Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is...

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Bibliographic Details
Main Authors: Hungyang L., Boonkar Y., Yong T.C., Khan N., Ibrahim M.R., Tan L.C.
Other Authors: 56535329100
Format: Conference Paper
Published: Institute of Electrical and Electronics Engineers Inc. 2023
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