Development of insulated cu wire stitch bonding

• Main Authors: Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Faiz, M.
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: T Technology (General); TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.um.edu.my/15601/1/0001.pdf; http://eprints.um.edu.my/15601/

The market demands for higher pin counts and more chips functionality poses challenges in conventional wire bonding. However, the novel insulated Cu wire technology enables fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper...