Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire / Mohd Firdaus Manap

• 第一著者: Mohd Firdaus , Manap
• フォーマット: 学位論文
• 出版事項: 2017
• 主題: T Technology (General); TJ Mechanical engineering and machinery
• オンライン･アクセス: http://studentsrepo.um.edu.my/8479/4/mohd_firdaus.jpeg; http://studentsrepo.um.edu.my/8479/8/Thesis_for_turnitin%2Drev2.pdf; http://studentsrepo.um.edu.my/8479/

The free air ball (FAB) formation during wire bond process of fine diameter palladium coated copper (PdCu) wire and bare copper wire were observed. The formation of FAB is studied by using FAB measurement method with different shielding gas types and gas flow rates as input parameters. The effect...