Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire / Mohd Firdaus Manap

The free air ball (FAB) formation during wire bond process of fine diameter palladium coated copper (PdCu) wire and bare copper wire were observed. The formation of FAB is studied by using FAB measurement method with different shielding gas types and gas flow rates as input parameters. The effect...

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Bibliographic Details
Main Author: Mohd Firdaus , Manap
Format: Thesis
Published: 2017
Subjects:
Online Access:http://studentsrepo.um.edu.my/8479/4/mohd_firdaus.jpeg
http://studentsrepo.um.edu.my/8479/8/Thesis_for_turnitin%2Drev2.pdf
http://studentsrepo.um.edu.my/8479/
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