Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip
In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire-Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performe...
Saved in:
Main Authors: | , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2012
|
Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/6949/1/22_MCP_136.pdf http://eprints.utem.edu.my/id/eprint/6949/ http://www.journals.elsevier.com/materials-chemistry-and-physics http://dx.doi.org/10.1016/j.matchemphys.2012.07.036, |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|