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Oxidation study on as-bonded intermetallic of copper wire-aluminum bond pad metallization for electronic microchip

In this work, influence of Copper free air ball (FAB) oxidation towards Intermetallic Compound (IMC) at Copper wire-Aluminum bond pad metallization (Cu/Al) is studied. Samples are synthesized with different Copper FAB oxidation condition by turning Forming Gas supply ON and OFF. Studies are performe...

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Bibliographic Details
Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Lim, Boon Huat
Format: Article
Language:English
Published: Elsevier 2012
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/6949/1/22_MCP_136.pdf
http://eprints.utem.edu.my/id/eprint/6949/
http://www.journals.elsevier.com/materials-chemistry-and-physics
http://dx.doi.org/10.1016/j.matchemphys.2012.07.036,
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http://eprints.utem.edu.my/id/eprint/6949/1/22_MCP_136.pdf
http://eprints.utem.edu.my/id/eprint/6949/
http://www.journals.elsevier.com/materials-chemistry-and-physics
http://dx.doi.org/10.1016/j.matchemphys.2012.07.036,

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