Improvement of Cu-Al bond integrity on low k pad structures

• Main Authors: Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
• Other Authors: 36992192300
• Format: Conference paper
• Published: 2023
• Subjects: Copper; Electric properties; Gold; Intermetallics; Mechanical properties; Thermal aging; Wire; Bond integrities; Copper wires; Diffusion rate; Electrical and mechanical properties; Gold wire; Higher temperatures; Industrial requirements; Intermetallic formation; Pad structures; Wire bonds; Wirebonding; Aluminum

Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-b...