Manufacturability readiness of insulated Cu wire bonding process in PBGA package
Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is...
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my.uniten.dspace-219342023-05-16T10:46:09Z Manufacturability readiness of insulated Cu wire bonding process in PBGA package Hungyang L. Boonkar Y. Yong T.C. Khan N. Ibrahim M.R. Tan L.C. 56535329100 26649255900 16029485400 9736201900 16021986000 57661553500 Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 ?m in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ?17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary. © 2014 IEEE. Final 2023-05-16T02:46:09Z 2023-05-16T02:46:09Z 2014 Conference Paper 10.1109/EPTC.2014.7028288 2-s2.0-84946693646 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84946693646&doi=10.1109%2fEPTC.2014.7028288&partnerID=40&md5=943508fd7591cd3a638710ccc852a488 https://irepository.uniten.edu.my/handle/123456789/21934 7028288 215 219 Institute of Electrical and Electronics Engineers Inc. Scopus |
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Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 ?m in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ?17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary. © 2014 IEEE. |
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56535329100 |
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56535329100 Hungyang L. Boonkar Y. Yong T.C. Khan N. Ibrahim M.R. Tan L.C. |
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Conference Paper |
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Hungyang L. Boonkar Y. Yong T.C. Khan N. Ibrahim M.R. Tan L.C. |
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Hungyang L. Boonkar Y. Yong T.C. Khan N. Ibrahim M.R. Tan L.C. Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
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Hungyang L. |
title |
Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
title_short |
Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
title_full |
Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
title_fullStr |
Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
title_full_unstemmed |
Manufacturability readiness of insulated Cu wire bonding process in PBGA package |
title_sort |
manufacturability readiness of insulated cu wire bonding process in pbga package |
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Institute of Electrical and Electronics Engineers Inc. |
publishDate |
2023 |
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1806424220888989696 |
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13.222552 |