Characterisation of insulated Cu wire ball bonding

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...

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Bibliographic Details
Main Authors: Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.
Other Authors: 55787052600
Format: Article
Published: Maney Publishing 2023
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