Development of insulated Cu wire ball bonding

• Main Authors: Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
• 其他作者: 55787052600
• 格式: Conference paper
• 出版: 2023
• 主題: Bonding; Electronics packaging; Industrial electronics; Manufacture; Technology; Bond structures; Bonding parameters; Bonding strength; Cu-wire bondings; Electric flame-off (EFO); Generation technologies; Pad craterings; Wire pull strength; Wire

Insulated Cu wire is the next generation technology in fine pitch and high density wire bonding, which enables wire crossing and touching without concern for wire-to-wire shorts. However, insulated Cu wire bonding is still at the infant stage compared to Cu wire bonding. This study investigates the...