In-depth study and characterization of insulated Cu wire ball bonding

• المؤلفون الرئيسيون: Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2013
• الموضوعات: T Technology (General); TK Electrical engineering. Electronics Nuclear engineering
• الوصول للمادة أونلاين: http://eprints.um.edu.my/15611/1/0001.pdf; http://eprints.um.edu.my/15611/

The increasing market demand for higher pin counts and more chips functionality poses challenges in conventional wire bonding process. The novel insulated Cu wire technology offer potential solution for fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires...