Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

• Main Authors: Quadir, M.Z., Singh, Gurbinder, Rickard, W.D.A., Haseeb, A.S. Md. Abdul
• 格式: Article
• 出版: Elsevier 2020
• 主题: TJ Mechanical engineering and machinery
• 在线阅读: http://eprints.um.edu.my/25376/; https://doi.org/10.1016/j.matlet.2019.126833

This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves s...