Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves s...

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Bibliographic Details
Main Authors: Quadir, M.Z., Singh, Gurbinder, Rickard, W.D.A., Haseeb, A.S. Md. Abdul
Format: Article
Published: Elsevier 2020
Subjects:
Online Access:http://eprints.um.edu.my/25376/
https://doi.org/10.1016/j.matlet.2019.126833
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