Stitch Bonding Strength of Cu Wire on AuAg/Pd/Ni Preplated Cu Leadframes: Influence of AuAg Thickness

• Main Authors: Tey, Sock Chien, Lau, Kok Tee, Mohamad Noor, Mohd Hafizul, Tham, Yon Loong, Abd Manaf, Mohd Edeerozey
• Format: Article
• Language: English
• Published: Trans Tech Publications 2015
• Subjects: TK Electrical engineering. Electronics Nuclear engineering; TS Manufactures
• Online Access: http://eprints.utem.edu.my/id/eprint/17769/1/AMM.761.364%20%281%29.pdf; http://eprints.utem.edu.my/id/eprint/17769/; http://www.scientific.net/AMM

Copper (Cu) wire bonding on the pre-plated leadframes with Ni/Pd/AuAg plating has been applied extensively in the semiconductor industry for the interconnection of integrated-circuit (IC) packaging due to the lower material cost of Cu and its excellent electrical properties. Furthermore, the Cu wir...