Holdings: Wire bond shear test simulation on hemispherical surface bond pad

Link to publisher's homepage at http://www.ttp.net/

Saved in:

Bibliographic Details
Main Authors:	Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Wan Mokhzani, Wan Norhaimi, Johari, Adnan, Assc. Prof. Dr., Palianysamy, Moganraj
Other Authors:	W.M.W. Norhaimi, J. Adnan, M. Palianysamy
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	ANSYS Hemisphere surface bond pad Shear test Wire bond
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646
Tags:	Add Tag No Tags, Be the first to tag this record!