Determination Of Fracture Toughness In PBGA Packages Using Finite Element And Experimental Methods
Electronic packages especially the plastic ball grid array (PBGA) has its unique crack failure arising from the soldering process. The existence of moisture absorbed in package from ambient condition causes vapor pressure. During reflow soldering processes (215°C), the moisture absorbed vaporizes...
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| Format: | Thesis |
| Language: | English |
| Published: |
2006
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| Online Access: | http://eprints.usm.my/56293/1/00001671787%20TCP.pdf http://eprints.usm.my/56293/ |
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