BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy
Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221°C and 217°C, respectively are the most prominent sold...
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| Main Authors: | , , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5256 |
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