Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

• Main Authors: Muhammad N.A., Bais B.H., Ahmad I., Isnin A.
• Other Authors: 26531512000
• Format: Conference paper
• Published: 2023
• Subjects: Elemental analysis; Intermetallic compounds; Metallurgical bonding; Reflow profile; Visual micrograph; Ball grid arrays; Chemical analysis; Flip chip devices; Intermetallics; Metallurgy; Rapid thermal annealing; Rapid thermal processing; Silver; Soldering alloys; Substrates; Tin; Electroless nickel immersion gold; Manufacturing process; Peak temperatures; Reflow > soldering; Sn3.5Ag solder; Solder joints; Soldering

Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow s...