Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement
A study was conducted on BGA lead-free C5 solder joint system to assess the effect of Germanium addition to Sn3.5Ag solder alloy through comparison study of Sn3.5Ag vs. Sn3.5AgGe. The main objective of this study is to find a way to resolve solder surface oxidation after thermal processes, while det...
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| Main Authors: | , , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5255 |
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