A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint

• Main Authors: Leng, E.P., Ding, M., Ling, W.T., Amin, N., Ahmad, I., Lee, M.Y., Haseeb, A.S.M.A.
• 出版: 2017
• 在线阅读: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5278

Eu RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag 1 and Sn-Ag-Cu 1 eutectic solders with melting temperatures of 221°C and 217°C, respectively are...