Holdings: Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

Link to publisher's homepage at http://www.scientific.net/

Saved in:

Bibliographic Details
Main Authors:	Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
Other Authors:	izianayahya@gmail.com
Format:	Article
Language:	English
Published:	Scientific.Net 2013
Subjects:	Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/25577
Tags:	Add Tag No Tags, Be the first to tag this record!