BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy

• Main Authors: Leng, E.P., Ling, W.T., Amin, N., Ahmad, I., Han, T.Y., Chiao, C.W., Haseeb, A.S.M.A.
• Published: 2017
• Online Access: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5256

Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221°C and 217°C, respectively are the most prominent sold...