Intermetallic growth kinetics of SN-3.5AG solder sandwiched between two copper substrates / Nurfarahin Mohamad Nazri
Solder is an alloy with low melting temperatures which is commonly used to joint electronic parts together. Most commonly used solder are usually consist of tin and lead, however the use of lead is prohibited since it brings harm towards the environment. Therefore in this research, the study of Sn-3...
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| Format: | Student Project |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/49671/1/49671.pdf https://ir.uitm.edu.my/id/eprint/49671/ |
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