Holdings: Shear speed analysis on Sn-3.9Ag-0.6Cu Solder

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Bibliographic Details
Main Authors:	Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Ong, Tee Say, Vairavan, Rajendaran
Other Authors:	zaliman@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications (TTP) 2014
Subjects:	Ansys Ball grid array (BGA) Shear speed Stress
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/35387
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