Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper

• Main Authors: Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Y. T., Chin
• Format: Conference or Workshop Item
• Language: English
• Published: 2012
• Subjects: T Technology (General); TA Engineering (General). Civil engineering (General)
• Online Access: http://umpir.ump.edu.my/id/eprint/6670/1/IEMT2012-P131.pdf; http://umpir.ump.edu.my/id/eprint/6670/; http://dx.doi.org/10.1109/IEMT.2012.6521825

Doping lead-free solders with minor additions of alloying and impurity elements such as Ni, Bi or Zn appears to have major effects on the growth of intermetallics (IMC) in solder joints during reflow soldering between the Sn-AgCu lead-free solders and the surface finish metallurgy. In this pape...