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Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation

Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study...

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Bibliographic Details
Main Authors: Chew, C.S., Durairaj, R., Haseeb, A.S. Md. Abdul, Beake, B.
Format: Article
Language:English
Published: Emerald 2015
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf
http://eprints.um.edu.my/15662/
http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001
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http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf
http://eprints.um.edu.my/15662/
http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001

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