A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish
A comparative study was conducted with Sn3.5%Ag and Sn3.8%Ag0.7%Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level, Sn3.5Ag showed no intermetallic brittle failure in cold ball pull test under an...
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| Main Authors: | , , , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5294 |
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