Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys

• Main Authors: Shnawah, D.A., Sabri, M.F.M., Badruddin, I.A., Said, S.M., Bashir, M.B.A., Sharif, N.M., Elsheikh, M.H.
• Format: Article
• Language: English
• Published: 2015
• Subjects: T Technology (General); TJ Mechanical engineering and machinery; TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.um.edu.my/13908/1/Study_on_coarsening_of_Ag3Sn_intermetallic_compound_in_the_Fe.pdf; http://eprints.um.edu.my/13908/; http://www.sciencedirect.com/science/article/pii/S0925838814024621

The present study focuses on coarsening of Ag3Sn intermetallic compound in the Sn-1Ag-0.5Cu and Fe-modified Sn-1Ag-0.5Cu solder alloy. The investigations showed that the Ag3Sn intermetallics coarsened rapidly in the Sn-1Ag-0.5Cu solder alloy whereas the Ag3Sn intermetallics were found to be quite st...