Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish
Sn3.5Ag and Sn3.8Ag0.7Cu (SAC387) Pb-free solder alloys on Ni/Au BGA pad finishing were studied for manufacturability, component mechanical robustness and board level reliability. Reflow profile windowing study showed that both alloys would form solder joint properly with profiles with peak temperat...
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5286 |
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