Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish
In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level...
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| Main Authors: | , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5289 |
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