Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish

• المؤلفون الرئيسيون: Leng, E.P., Ding, M., Lindsay, W., Chopin, S., Ahmad, I., Jalar, A.
• منشور في: 2017
• الوصول للمادة أونلاين: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5289

In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level...