Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process
Reliability of surface mount components and interconnect are significant issues in electronic manufacturing. Although the reliability of devices has been broadly studied,here we are focusing on the reliability of the solder joint after the self-alignment phenomena during reflow soldering.In this stu...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Teknikal Malaysia Melaka
2018
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| Online Access: | http://eprints.utem.edu.my/id/eprint/21356/2/2018%20JTEC%20Paper%202_Najib_FKP.pdf http://eprints.utem.edu.my/id/eprint/21356/ |
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