Computational Methods In Flip Chip Assembly.

• Main Authors: Hj Abdul Azid, Assoc. Prof. Dr Ishak, Seetharamu, Prof. K.N., Abdul Quadir, Assoc. Prof. Dr Ghulam
• Format: Monograph
• Published: Universiti Sains Malaysia 2002
• Subjects: TJ1 Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/10662/

Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive &...