Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

• المؤلفون الرئيسيون: Kar Y.B., Hui T.C., Agileswari R., Lo C.
• مؤلفون آخرون: 26649255900
• التنسيق: مقال
• منشور في: 2023
• الموضوعات: Copper; Diffusion; Drops; Electronics packaging; Intermetallics; Nickel; Polymers; Reliability; Testing; Analytical software; Ball grid array packages; Comparison study; Cu diffusion; Diffusion rate; Drop test; Drop test reliability; Drop-balls; High temperature stress; IMC thickness; Kirkendall void; Lead-free products; Reliability performance; Reliability test; Solder ball shear; Solder balls; Solder joints; Stress test; Work study; Soldering

Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is muc...