Ali Mokhtar, M. N. (2018). Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka.
استشهاد بنمط شيكاغوAli Mokhtar, Mohd Najib. Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka, 2018.
MLA استشهادAli Mokhtar, Mohd Najib. Reliability Assessment Of Self-Alignment Assemblies Of Chip Component After Reflow Soldering Process. Penerbit Universiti Teknikal Malaysia Melaka, 2018.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.