Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering

• Main Author: Chong, Jia Jun
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2019
• Subjects: T Technology; TJ Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/58414/1/Influence%20Of%20Copper%20Pillar%20Bump%20Structure%20On%20Flip%20Chip%20Packaging%20During%20Reflow%20Soldering.pdf; http://eprints.usm.my/58414/

Consumer electronics market is one of the fastest growing markets in the world. Flip chip (FC) technology is one of the technologies for interconnecting semiconductor devices, and with the demand for shrinking in footprint of electronic packages, FC technology must handle the increase in I/O interco...