Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research toward lead-free solder alloy became a concern. Tin-copper (SnCu) solder alloy is one of the candidates that can meet the characteristic of tin–lead (SnP...
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| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Springer Nature
2023
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf http://umpir.ump.edu.my/id/eprint/37467/ https://doi.org/10.1007/978-981-19-1457-7_67 |
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