Numerical Simulation Of Self-Alignment Of Chip Resistor Components For Different Silver Content During Reflow Soldering

• Main Authors: Abdullah, Mohd Zulkifly, Ali Mokhtar, Mohd Najib, Saad, Abdullah Aziz, Samsudin, Zambri, Che Ani, Fakhrozi
• Format: Article
• Language: English
• Published: Elsevier Ltd. 2017
• Online Access: http://eprints.utem.edu.my/id/eprint/22722/2/MR%20journal%202017.pdf; http://eprints.utem.edu.my/id/eprint/22722/; https://www.sciencedirect.com/science/article/pii/S0026271417304870

Three-dimensional simulation and experimental investigation of self-alignment phenomena during the reflow soldering process were presented. The multiphase flow model was developed using ANSYS Fluent to investigate the self-alignment effect of laminar melted lead-free solder during the reflow phase o...