Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process

• Main Authors: Fauzi, Muhamad Razizy, Amiruddin, Nurul Amira, Osman, Saliza Azlina, Mohamed Anuar, Rabiatul Adawiyah
• Format: Article
• Language: English
• Published: Trans Tech Publications 2022
• Subjects: T Technology (General)
• Online Access: http://eprints.uthm.edu.my/7168/1/P13799_ca974b0f5af06ec4a8dad91f88901bfc.pdf; http://eprints.uthm.edu.my/7168/; https://doi.org/10.4028/p-s3b2n1

The different composition material of copper substrate significantly affects the intermetallic compound (IMC) formation and the solder joints durability. This study was conducted on the interfacial reaction between lead-free solder and the different copper substrates via reflow soldering. The s...