Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

• Main Authors: Lau, Chun Sean, Abdullah, M. Z., Mujeebu, M. Abdul, Yusof, N. Md,
• Format: Article
• Language: English
• Published: Taylor's University 2014
• Subjects: TJ1-1570 Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/39129/1/FINITE_ELEMENT_ANALYSIS_ON_THE_EFFECT_OF_SOLDER.pdf; http://eprints.usm.my/39129/; https://www.researchgate.net/publication/288277707_Finite_element_analysis_on_the_effect_of_solder_joint_geometry_for_the_reliability_of_ball_grid_array_assembly_with_flexible_and_rigid_PCBS

In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs subjected to thermo-cyclic loading. The commercial...