Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars

• Main Authors: Wakeel, Saif, Haseeb, A. S. Md. Abdul, Hoon, Khoo Ly, Amalina, Muhammad Afifi
• Format: Article
• Published: IEEE-Inst Electrical Electronics Engineers Inc 2022
• Subjects: TS Manufactures
• Online Access: http://eprints.um.edu.my/41404/

In this work, two commercial no clean fluxes, namely, extremely low residue no-clean flux (NCF) (NC-1) and ordinary NCF (NC-2), were used for the preparation of a fine pitch flip-chip package with a 7.6 x 7.6 mm(2) Si die on a 17 x 17 mm(2) organic substrate. One water-soluble (WS) flux was also use...