Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
The flexible printed circuit boards (FPCB) offer several advantages in meeting the electronic applications' growing demands. Certain limitations like inadequate reflow profile cause reliability issues in the manufacturing assembly process. The study aims to investigate the characteristics of in...
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| Main Author: | |
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| Format: | UMK Etheses |
| Language: | English |
| Published: |
2021
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| Online Access: | http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf http://discol.umk.edu.my/id/eprint/10777/ |
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