Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

• Main Authors: Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.
• Format: Article
• Language: English
• Published: W. S. Maney & Son 2014
• Online Access: http://psasir.upm.edu.my/id/eprint/34236/1/Interfacial%20reaction%20of%20Bi%E2%80%93Ag%20and%20Bi%E2%80%93Sb%20solders%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf; http://psasir.upm.edu.my/id/eprint/34236/; http://tandfonline.com/doi/full/10.1179/1432891714Z.000000000976

Owing to the toxicity of lead, much effort has been put in studies on lead-free solders after environmental legislations prohibited the use of lead in these parts worldwide. Here, Bi–Ag and Bi–Sb alternative solder alloys containing 1·5–5 wt-% Ag and Sb were investigated. The effect of the reflow nu...