Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject...

Full description

Saved in:
Bibliographic Details
Main Authors: Shualdi, W., Ahmad, I., Omar, G., Isnin, A.
Format:
Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5273
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items