Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
Reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) s...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Pahang
2013
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/4004/1/P184.pdf http://umpir.ump.edu.my/id/eprint/4004/ http://ijame.ump.edu.my/images/Volume_8/22_Azmah%20Hanim%20et%20al.%20s.pdf |
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