Intermixing reactions in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects during room temperature and high temperature aging
Current push for miniaturization and 3D packaging makes it important to understand reactions in interconnects with ultra small volume. In order to reduce processing time and to have more homogeneous interconnects, solder can be designed in a multilayer form with components layer thickness in the sub...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Springer
2015
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/13857/1/Intermixing_reactions_in_electrodeposited_CuSn_and_CuNiSn.pdf http://eprints.um.edu.my/13857/ http://link.springer.com/article/10.1007/s10854-014-2398-9 |
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