Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject...

Full description

Saved in:
Bibliographic Details
Main Authors: Shualdi W., Ahmad I., Omar G., Isnin A.
Other Authors: 36194999100
Format: Conference paper
Published: 2023
Subjects:
Tin
Tags: Add Tag
No Tags, Be the first to tag this record!