The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan
A solder joint serves as a mechanical support and heat dissipator in an electronics board. Thus, logically, there is a need for high reliability. The reliability of solder joints in electronic systems is an issue that affects all aspects of the production and use stages. In any aspect of packaging t...
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| Format: | Article |
| Language: | English |
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Penerbit UiTM (UiTM Press)
2024
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| Online Access: | https://ir.uitm.edu.my/id/eprint/100865/1/100865.pdf https://ir.uitm.edu.my/id/eprint/100865/ |
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