The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

• Main Authors: M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir
• Format: Article
• Published: Wiley-VCH Verlag 2019
• Subjects: TA401-492 Materials of engineering and construction. Mechanics of materials
• Online Access: http://eprints.uthm.edu.my/4240/; https://dx.doi.org/ 10.1002/mawe.201800212

The effect of intermetallic compound layer between Sn-4.0 Ag-0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound wer...