The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan
Due to environmental concerns, lead-free solders were introduced to replace the lead-based solders in microelectronics devices technology. Although there were many lead-free solder available, the Sn-Ag-Cu was considered as the best choice. But the solder has its draw backs in terms of melting temper...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Teknologi MARA, Perlis
2012
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| Subjects: | |
| Online Access: | http://ir.uitm.edu.my/id/eprint/34375/1/34375.pdf http://ir.uitm.edu.my/id/eprint/34375/ https://jurnalintelek.uitm.edu.my/index.php/main |
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