Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film
Tin-based multilayered thin films were fabricated for application in three dimensional microelectronic packaging as joining materials. During device fabrication and application, interconnecting materials can be fully converted to intermetallic compounds (IMCs). As known, IMCs are generally brittle a...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Springer
2018
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/21927/ https://doi.org/10.1007/s10854-017-8030-z |
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