Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

• Main Authors: Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
• Format: Conference or Workshop Item
• Language: English; English
• Published: 2015
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf; http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf; http://umpir.ump.edu.my/id/eprint/11780/; http://eprints.uthm.edu.my/7233/

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...