Characterisation of insulated Cu wire ball bonding
Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...
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Main Authors: | Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M. |
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Format: | Article |
Published: |
Maney Publishing
2014
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Subjects: | |
Online Access: | http://eprints.um.edu.my/15473/ |
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