Insulated Cu wire free air ball characterization
Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 μm insula...
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| Main Authors: | , , , , |
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2018
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| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8782 |
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